Platform Introduction

Construction Goals and General Overview

The Micro/Nano Manufacturing Technology Research Center is a public platform affiliated with the BIT Chongqing Institute of Microelectronics and Microsystems. It has a planned ultra-clean laboratory area of over 1,000 square meters and more than 80 sets of various process equipment. The center focuses on the frontier of micro/nano processing technology and the demands of application fields such as intelligent sensing, projection, optical imaging, lidar, and spectral analysis. In particular, it aims to meet the practical needs of micro/nano processing in optical & inertial MEMS devices, 3D heterogeneous integrated devices, terahertz MEMS devices, and the development of new semiconductor materials. The goal is to build a comprehensive research center integrating advanced material processing, MEMS device process preparation, and customized micro/nano process development. The center will achieve sub-micron precision structure and device controllable processing of new materials, and provide customers with customized process technology development services and full-process solutions for device mass production.

Team Leader

Center Staff and Equipment Configuration

The center currently has more than 10 full-time technical staff, including three individuals with associate professor-level titles and four with engineer titles. The team is led by an internationally renowned MEMS scientist and consists of core experts with over 10 years of experience in micro/nano manufacturing process development for MEMS devices. To accommodate the full-process demands of MEMS device technology development, the center is organized into eight major modules: wet cleaning and etching processes, photolithography processes, coating processes, dry etching processes, high-temperature processes, wafer bonding processes, surface micro electroplating processes, thinning and polishing, and dicing processes. Each module is both independent and coordinated, covering the entire process chain required for MEMS device manufacturing, providing a multifunctional technical support system for the development of advanced devices and technologies, such as optical MEMS, acoustic MEMS, inertial MEMS, silicon-based semiconductor materials, CMOS-MEMS integration, and 3D heterogeneous integration, as well as serving as an incubator for high-tech enterprises.

The equipment at the center is designed to be compatible with wafer sizes ranging from 6 inches to 4 inches, meeting the mass production R&D needs of MEMS companies while also accommodating prospective R&D requirements of universities and research institutes. The center is equipped with various exposure methods (stepper projection exposure, contact full-field exposure), coating methods (magnetron sputtering, chemical vapor deposition, inductively coupled plasma chemical vapor deposition, low-pressure chemical vapor deposition, electron beam evaporation, atomic layer deposition, precision electroplating, thermal oxidation), and etching methods (inductive coupled plasma etching, reactive ion etching, ion beam etching, plasma ashing, dry steam etching). It also features thin film and device performance characterization tools (film thickness measuring instrument, thin film stress measurement instrument, scanning electron microscope, high-precision temperature probe station, step profiler, and 3D surface profiler).

Copyright: BIT Chongqing Institute of Microelectronics and Microsystems