The platform focuses on MEMS micro-mirrors and heterogeneous 3D integration as its core technologies. It establishes a domestically leading MEMS device R&D process line compatible with both 6" and 4" wafers, possessing complete silicon-based MEMS sensor/actuator micro-nano processing capabilities. The platform supports advanced technology research and development in the areas of new silicon-based semiconductor materials, nano-material growth, CMOS-MEMS integration, and heterogeneous 3D integration. At the same time, it offers comprehensive micro-nano new process and foundry services, providing solid guarantees for the development of innovative MEMS micro-nano sensors and micro-nano actuators. The cleanroom area includes a Class 1000 zone with 650 m² and a Class 100 zone with 125 m². Two phases of construction are planned with approximately 80 sets of process equipment.
